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NEW !! AP+ 全自動(dòng)芯片分選系統(tǒng)

適用芯片尺寸: 托盤放置: 0.2 mm2 - >25 mm2
               載帶放置: 0.5 mm2 - 17 mm2
 

輸入: 采用載帶框或蘭膜環(huán)，晶圓直徑至 Ø300 毫米
 

輸出: 載帶(寬度8 至 24 毫米，熱封或壓封)，Waffle packs 及Gel-Paks (2"- 4")，JEDEC盤，載帶框，蘭膜環(huán)或特別定制
 

放置精度: ± 12.5 微米(重復(fù)精度)
 

拾取原理: 表面或頂部邊緣真空拾取(采用：Rubber, Vespel,Tungsten carbide, elastomer) 可選非表面接觸的Vespel edge grip
 

產(chǎn)能: 根據(jù)不同產(chǎn)品，*短1.3 秒/循環(huán)

Die Pick & Place Systems (Royec)

NEW!!!!!AP+ automatic chip sorting system

Applicable chip size: tray placement: 0.2mm2-> 25mm2

Belt placement: 0.5 mm2 - maximum 17 mm2

Input: the loading box or LAN zona, wafer to Ø 300 mm in diameter

Output: bandages (8 to 24 mm wide, hot or pressed), Waffle packs ａnd gel-paks (2" -4 "), JEDEC disks, bandages, blue film rings or specially tailored

Placement accuracy: ± 12.5 microns (repeat accuracy)

Principle of picking: vacuum pick on surface or top edge (Rubber, Vespel,Tungsten carbide, elastomer) optional non-surface contact Vespel edge grip

Capacity: minimum 1.3 seconds per cycle for different products