OAI的面板***掩模光刻機 Model 6020S, 用于FOPLP型號6020S -半自動化或自動化,實現500mm x 500mm晶圓尺寸的FO-PLP加工.
OAI’s Panel Level Mask Aligner for FOPLP Model 6020S - Semi or Automated
Enabling FO-PLP Processing at 500mm x 500mm Wafer Sizes
OAI掩模對準器，不同的印刷方式
距離: 間隙可設置在***個非常寬的范圍內，增量精度1µM
軟接觸: •基材被帶入非常柔軟的機械接觸曝光時的掩模。通過接觸力可調軟件設置
金屬觸點: •接觸額外的氮氣壓力
真空接觸: •真空***別控制接觸力。真空度為由用戶設置
OAI Mask Aligners
Various Printing Modes
PROXIMITY:
• THE GAP IS SETTABLE OVER A VERY WIDE RANGE WITH AN INCREMENTAL PRECISION OF 1µM
SOFT CONTACT:
• SUBSTRATE IS BROUGHT INTO VERY SOFT MECHANICAL CONTACT WITH THE MASK DURING EXPOSURE. THE CONTACT FORCE IS ADJUSTABLE VIA SOFTWARE SETTINGS
HARD CONTACT:
• CONTACT WITH ADDITIONAL N2 pressure VACUUM CONTACT:
• VACUUM LEVEL CONTROLS THE CONTACT FORCE. LEVEL OF VACUUM IS SET BY USER
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OAI’s Panel Level Mask Aligner for FOPLP Model 6020S - Semi or Automated
Enabling FO-PLP Processing at 500mm x 500mm Wafer Sizes
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